聚酰亚胺
硅氧烷
材料科学
聚合物
硅酮
微电子
钝化
高分子化学
复合材料
纳米技术
图层(电子)
出处
期刊:Acs Symposium Series
日期:1984-03-15
卷期号:: 259-269
被引量:6
标识
DOI:10.1021/bk-1984-0242.ch021
摘要
A photosensitive silicone polyamic acid is described. This material is easily prepared directly from the precursor silicone polyamic acid. Properties and characteristics of this polymer system are discussed including handling, use, and practical photochemistry. Thermal tempering of the photosensitive or crosslinked polymer gives the polyimide siloxane which has been previously shown to be an excellent candidate as an insulating polymer in electronics. The use of such a directly patternable polyimide for dielectric and passivation applications, particularly in microelectronics, should become increasingly important as polyimides become more widely accepted in the industry.
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