Research on SiP Signal Integrity Based on Ansys SIwave in Wearable Medical Systems

One of the main challenge for wearable medical systems is how to integrate more functional ICs in a very small space. As a kind of new packaging and system integration technology, SiP (System in Package) simplifies the system design and complies with the requirements of device miniaturization with multi-component integration. However, high layout and routing density in SiP substrate tend to cause SI (Signal Integrity) and PI (Power Integrity) issues. This paper introduces the main reasons and improvement measures for signal and power integrity issues in SiP designs. Based on ANSYS SIwave simulation platform, the simulation process of major parameters for signal and power integrity and related optimization methods are discussed in the design process of SiP.