Thermal Flow Simuation and Measurements of 3D Si Chip Stacks with TSVs

Thermal management is crucial for 3D-IC, as it protects chips from various issues. To provide efficient thermal management techniques, it is essential to accurately understand the heat flow within a device. In this process, thermal simulation is important, allowing precise and detailed analysis of heat conduction within the device. Therefore, we established a thermal simulation flow for 3D Si chips stacks with TSV and the accuracy of the flow was validated by comparing the simulation results with experimental measurement results.