Quality Assurance Test System for Assembly of STS Modules for the BM@N Experiment

Abstract The Silicon Tracking System (STS) of the BM@N experiment will be based on modules with Double-Sided microstrip Silicon Detectors (DSSD) which have been initially developed for the CBM experiment at FAIR. Each module consists of a DSSD, two front-end boards with 8 ASICs each, and a set of low-mass aluminum microcables. During the module assembly the microcables are tab-bonded to the sensor and readout ASICs. The module has 1024 channels on each side of the sensor. For the quality assurance of the ultrasonic bonding process a dedicated procedure based on the noise per channel measurements with a Pogo Pin test device was developed.