A broadband microwave absorber based on 3-D printing technology

This letter presents a porous broadband microwave absorption structure based on 3-D printing technology and resistive film materials. In simple terms, the structure is a threedimensional periodic array formed by resistive film and 3-D printing material, with a thickness of 24 mm. In the process of electromagnetic simulation design, the introduction of layered structure greatly optimized the absorption effect, inspired by impedance matching in microwave engineering. The experimental results show that if the electromagnetic wave is vertically incident, the reflectivity of this structure is below -10dB in the range of 240 GHz, with an absorption relative bandwidth of 180.95%. In addition, it also performs excellently when the microwave enters at a large angle.