Thermomechanical analysis, dynamic mechanical analysis, differential scanning calorimetry, and dielectric thermal analysis were used to determine the glass transition temperature of hot-curing epoxy siloxane composites. The effect of polymethylphenylsiloxane resin on the parameters of the three-dimensional structure and on the deformation and strength properties of epoxy novolac resin during curing by 4,4′-diaminodiphenylmethane was established.