Research progress in heat dissipation technology and materials used for high-power LED devices

As the power increases,LED(light emitting diode) devices appear much higher junction temperature.Furthermore,the reliability and working life will both be obviously reduced with the increase of junction temperature.So,heat dissipation technology and materials with high efficiency,low cost and high reliability are very important to design and prepare high-power LED devices.The progress of the heat dissipation technology and materials in the area of high-power LED device is reviewed in this paper from the following three aspects,design method of chip structure,auxiliary heat dissipation technologies and devices,and a series of heat dissipation materials used in the encapsulation area of LED devices.