Copper deposition on stainless steel sheets in copper nitrate solution

The aim of this study was to examine factors that influence copper nitrate based electrorefining of copper and to search the best process parameters for high-purity copper deposition on AISI 316L steel blanks. Considering impurities, the most important goal was to minimize sulfur content in a copper cathode. The effect of Cu 2+ concentration, current density, temperature and pH were studied. The best parameters for the best copper purity were sorted out. The most important factors for quality copper deposition are sufficiently low Cu 2+ concentration, low current density, right zone and careful control of pH. Active nitrate ion reduction reactions catalyzed by copper ions are suggested to affect detrimentally both copper deposition current efficiency and purity. Furthermore, nitrate ion reactions seem to elevate an electrolyte pH so that the deposition appears to be dark brow copper oxide. The 6N purity for copper was not reached with this cell construction and it felled behind about 7 ppm (99.9993% Cu). Both, sulfur and silver concentration were slightly above 1 - 2 ppm. To minimize the impurities, electrolyte circulation and filtration are needed. Also, either a separate silver cementation cell or cementation membrane is needed.