Optimizing the Nano Wiring and KlettSintering parameters for low-temperature die to DCB attach of power electronic chips

KlettWelding-Tape is a sintering foil which can be used for die attach to replace conventional soldering techniques. As sown in Figure 2, it consists of a pure copper sheet which is on both sides covered with electrochemical deposited NanoWires [1]–[3]. The standard design is a 20 µm copper core with a 45 µm NanoWiring made of copper with a diameter of 1000 nm. The Nanowire coating enables a sintering process to another surface. As shown in Figure 1, the KlettWelding Tape is placed between the joining partners. Subsequently the partners are heated and pressed together resulting in a strong and pure copper interconnect.