Warpage Simulation on a Typical Fan-out Panel Level Package (FOPLP) Process with Glass Carrier

Thermal warpage creates during fan-out panel level package (FOPLP) manufacturing process and it may causes challenges on subsequent procedures. To this end, finite element analysis (FEA) with element birth and death techniques were performed in this study to simulate warpages during a typical RDL-first (redistribution layer first) FOPLP process, and effective material property equations were used to simplify the complex RDL structure in an fan-out (FO) packaging. To identify the optimal factorial combinations on design parameters, Taguchi methods with adequate orthogonal array were applied on process warpage simulations. It is concluded from the results that warpage value can be reduces by 90% if the optimized experimental parameters was used for the FOPLP process.