材料科学
磨料
化学机械平面化
抛光
冶金
纳米技术
机械强度
质量(理念)
复合材料
表面改性
表面粗糙度
作者
Qing Ma,Xinhuan Niu,Jiakai Zhou,Ziliang Liu,Mengqi Wang,Shaobo Song,Zheng Wu,Bin Hu,Jin Li,Jiao Hong
摘要
This review summarizes CMP abrasive design, properties, removal mechanisms, optimization, applications, challenges, and future directions for balancing removal rate and surface quality in ultra-precise processing of hard-brittle materials.
科研通智能强力驱动
Strongly Powered by AbleSci AI