材料科学
电介质
聚苯乙烯
亚苯基
介电损耗
高分子化学
热稳定性
聚丁二烯
聚合物
耗散因子
聚合
酰胺
化学工程
复合材料
共聚物
有机化学
化学
光电子学
工程类
作者
Sai Zhang,Yulin Zhang,Zhi Yuan Wang,Wenxiao Qiao
摘要
Abstract In this article, a facile and efficient approach to the modification of polystyrene (PS) materials with low dielectric properties at high frequency is reported. A series of N ‐acetoxy amide (AA)‐containing polystyrenes (PSAAs) synthesized by free‐radical polymerization can be transformed into NCO‐containing polymers (rPSAAs) via Lossen rearrangement reaction of the AA group. The modified PS materials were then obtained by reacting the rPSAAs with hydroxyl‐terminated poly(phenylene oxide) (PPOD), polybutadiene, and amino‐terminated polysiloxane, respectively. The thermal stability, mechanical, and dielectric properties of PPOD‐modified PS materials were improved with increase of PPOD content. The PPOD (20 wt%)‐modified PS had a dielectric constant of 2.22 and dissipation factor of 1.65 × 10 −3 at 10 GHz. This work provides an easy and effective method to prepare high performance modified PS materials by introducing poly(phenylene oxide), which could meet the requirement of new‐generation communication technology.
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