The characteristics of line-shaped defects and their impact mechanism on device performance in β-Ga2O3 Schottky barrier diodes

Beta-phase gallium oxide (β-Ga2O3) has attracted increasing attention in the field of power electronic devices due to its ultra-wide bandgap and high Baliga figure-of-merit. However, the premature breakdown deteriorated with the increase in device area, hindering the scale-up of the current rating. In this work, we unveil the formation and characteristics of killer defects responsible for the premature breakdown in an Si-doped (001) β-Ga2O3 epitaxial layer grown by halide vapor phase epitaxy. The killer defects feature a line-shaped morphology along the [010] orientation. Specifically, the high-resolution transmission electron microscopy characterization links the line-shaped defects to underlying voids. These voids are surrounded by amorphous phase regions, and the transition from amorphous phase to crystalline phase results in twins extending along the [010] orientation, which eventually become line-shaped defects on the wafer. Additionally, the defect area exhibits smaller capacitance and lower surface potential compared to the defect-free region. This is attributed to the absence of local ionized donors in the defect area, leading to electric field concentration in this region. This study systematically investigates a killer defect in β-Ga2O3, which contributes to the scale-up process of β-Ga2O3 power devices and advances their application.