聚烯烃
材料科学
聚苯乙烯
复合材料
电介质
介电损耗
聚合物
印刷电路板
计算机科学
光电子学
图层(电子)
操作系统
作者
Shujuan Wang,Lu Wang,Bin Wang,Hongzhe Su,Wei Fan,Xinli Jing
出处
期刊:Polymer
[Elsevier]
日期:2021-10-01
卷期号:233: 124214-124214
被引量:14
标识
DOI:10.1016/j.polymer.2021.124214
摘要
With the rapid development of the fifth-generation mobile communication, stringent requirements have been put forward for the dielectric properties of polymer-based copper-clad laminates. However, thermally and mechanically robust materials with low dielectric loss (Dr) are very scarce. Herein, we propose a simple method to prepare cyclic polyolefin (COC)/polystyrene vitrimers (PSVMs) from semi-interpenetrating polymer networks with low Dr. The topological rearrangement of PSVMs caused by the transesterification of nitrogen-coordinating cyclic boronic ester (NCB) linkages under heat helped uniformly disperse the COC in the PSVM. As a result, the COC-PSVM and its quartz glass fiber reinforced COC-PSVM composites exhibited excellent thermal, mechanical, and dielectric properties. Specifically, the dynamic reversibility of the NCB linkages under heat facilitated the complete recovery of the COC-PSVM composites. This study provides a new strategy for the preparation of resin matrix with low Dr for printed circuit boards, which is conductive to reducing the environmental pollution from e-waste.
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