Molecular simulation and curing-forming of ultraviolet/thermal-sensitive resin diamond composites for microstructured polishing tool

This study presented a novel preparation method of microstructured polishing tools by using ultraviolet/ thermal-curing liquid resin. Five mass ratios were designed for PRDC (photosensitive resin diamond composites) and TRDC (thermosensitive resin diamond composites) by MS (Materials Studio) software. The density, cohesive energy density, and blend compatibility of the components of TRDC and PRDC were comparatively analyzed. The effect of ultraviolet/thermal-curing parameters on the properties of as-prepared polishing tool was discussed. The results showed that the mass loss of TRDC after thermal-curing was lower than that of PRDC after ultraviolet-curing, the friction coefficient between TRDC and the grinding ball was lower than that between PRDC and grinding ball, and the micromorphology compactness of TRDC was better than that of PRDC. Polishing performance of the polishing tool was verified. The microfeature height shrinkage rate of the prepared abrasive tools was less than 4.3%, and the width expansion rate was less than 6.9%. After polishing for 15 min, the surface roughness of the copper plate can reach 76.667 nm. For the microstructure, the bottom surface roughness of the microgroove was 88.231 nm, and the side surface roughness was 121.593 nm. Using the ultraviolet/thermal-curing technology and taking the advantage of the fluidity of the liquid resin, polishing tools with the microstructured grooves could be prepared. The proposed method has a simple preparation process and yields products with controllable morphology, which provides a basis for microstructured surface processing.