High‐Temperature Polymer Dielectrics for Printed Circuit Board

Copper-clad laminate (CCL), as the substrate of printed circuit boards (PCBs), has developed vigorously recently. Here, the constant development of dielectric polymer resins gradually leads CCL to make progress in terms of performance. However, upgrading electronic products and circuit assembly technology makes PCB fabrication technology move toward fine trace, microvia, multiple layers, and high-density tracing. This lays higher requirements on CCL's thermal dissipation capability, dimensional stability, and dielectric loss, which thereafter brings forward new demands on the performance of polymer dielectrics. Herein, polymer dielectrics, especially high-temperature polymer dielectrics, are the main focus of Chapter 7. This chapter starts with the traditional epoxy resins for CCLs and first introduces the most traditional high-temperature polymer resin materials, including epoxy, phenolic resins, and polyimide. Then, we introduce polymer dielectrics suitable for high-frequency communication, such as LCP, PTFE, and so on.