纳米片
晶体管
金属浇口
粒度
阈值电压
逻辑门
材料科学
工艺变化
光电子学
场效应晶体管
MOSFET
电子工程
过程(计算)
GSM演进的增强数据速率
电压
电气工程
纳米技术
计算机科学
工程类
栅氧化层
电信
操作系统
作者
VARDHAN, PH,Amita .,Ganguly, S.,Ganguly U
标识
DOI:10.1109/ted.2019.2933061
摘要
Nanosheet gate-all-around (GAA) field-effect transistor (NSFET) is a potential replacement for the FinFET at advanced technology nodes owing to better control of short-channel effects and higher drive current. Due to the increased complexity of the GAA stacked structure, new forms of process variability come into the picture, which are dominant over the conventional process variability such as metal gate granularity (MGG) and line edge roughness (LER) for FinFETs. In this article, we show one such process variability called as metal thickness variation (MTV). MTV causes WF variations on the gates of the GAA sheet transistor and results in a significant V-T variability. The impact ofMTV is studied using an analytical framework. We studied three variants of NSFETs and reported variability in terms of key device design parameters such as intersheet spacing and metal thicknesses. The results presented here help in designing the process flow for a type of NSFET to minimize the V-T variability.
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