热电效应
材料科学
极限抗拉强度
热电材料
可靠性(半导体)
稳健性(进化)
机械强度
工程物理
纳米技术
复合材料
热导率
热力学
工程类
物理
基因
化学
功率(物理)
生物化学
标识
DOI:10.35848/1347-4065/acebfc
摘要
Abstract Thermoelectric research has become a prominent topic in recent years due to the mounting interest in providing alternative energy and reducing environmental pollution. The engineering applications of thermoelectric devices require high efficiency and mechanical robustness to ensure their reliability and stability. In this study, we investigated the material strength and failure mechanisms of Sb 2 Te 3 nanofilms using molecular dynamics simulations. We designed a series of Sb 2 Te 3 nanofilms to explore the effects of temperature, hole defects, and substrate on the mechanical properties of thermoelectric materials under tensile loading. Our findings provide valuable information for designing highly reliable and stable thermoelectric devices.
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