电感器
材料科学
MOSFET
碳化硅
电气工程
电磁线圈
dBc公司
门驱动器
功率MOSFET
结温
光电子学
模具(集成电路)
电压
功率(物理)
晶体管
工程类
CMOS芯片
纳米技术
冶金
物理
量子力学
作者
Jack Knoll,Jesi Miranda-Santos,Xingyu Chen,Christina DiMarino,Qiang Li
出处
期刊:
[Institute of Electrical and Electronics Engineers]
日期:2022-10-09
卷期号:: 1-7
被引量:9
标识
DOI:10.1109/ecce50734.2022.9947473
摘要
This work presents the design, prototyping, and characterization of a hybrid DBC/PCB-based 1.2 kV silicon carbide (SiC) MOSFET full-bridge integrated module building block (IMBB) with integrated coupled inductor and gate driver circuitry. Silver sintering and molybdenum posts are used to connect the SiC MOSFET dies to the gate driver PCB using a flip-chip assembly process. The IMBB has power loop and gate loop inductances of 4.5 nH and 1.6 nH, respectively. These low parasitic inductances allow the bottom switch to achieve 80 V/ns switching with a 4% voltage overshoot. Static characterization performed on the IMBB after the full packaging procedure has been completed indicates that all four dies in the full-bridge are functional. Silver-sintered MOSFET drains and the DBC substrate allow for junction-to-case and junction-to-ambient thermal resistances of 0.65 K/W and 1.18 K/W, respectively. The integrated coupled inductor's PCB windings are paralleled to reduce loss and internal temperature rise. The inductor has been tested to verify there is good current sharing in parallel windings. Following those tests, the inductor was tested in a 4.16 kW boost converter.
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