Process optimization of contact hole patterns via a simulated annealing algorithm in extreme ultraviolet lithography

The critical dimension (CD), roughness, and sensitivity are extremely significant indicators for evaluating the imaging performance of photoresists in extreme ultraviolet lithography. As the CD gradually shrinks, tighter indicator control is required for high fidelity imaging. However, current research primarily focuses on the optimization of one indicator of one-dimensional line patterns, and little attention has been paid to two-dimensional patterns. Here, we report an image quality optimization method of two-dimensional contact holes. This method takes horizontal and vertical contact widths, contact edge roughness, and sensitivity as evaluation indicators, and uses machine learning to establish the corresponding relationship between process parameters and each indicator. Then, the simulated annealing algorithm is applied to search for the optimal process parameters, and finally, a set of process parameters with optimum image quality is obtained. Rigorous imaging results of lithography demonstrate that this method has very high optimization accuracy and can improve the overall performance of the device, dramatically accelerating the development of the lithography process.