Investigation of Post-Bonding Die Stretching in Die-to-Wafer Hybrid Bonding

Low-temperature, high-accuracy die-to-wafer (D2W) hybrid bonding is increasingly employed to enable high bandwidth, high performance, and low power consumption packaged devices [1]. It is crucial to minimize overlay errors to achieve high electrical yield and package performance. A physics-based model is developed to replicate the dynamics of bonding propagation and post-bond die stretching. The simulation results are compared to experiment. The initial die warpage, bonding energy and pedestal design are optimized to achieve target die stretching specifications.