光探测
异质结
光电子学
材料科学
响应度
光电探测器
比探测率
半导体
暗电流
量子效率
作者
Maohua Chen,Tiange Zhao,Yiye Yu,Yuqiang Bai,Xiantai Tian,Meng Peng,Shikun Duan,Zhenyu Chen,Zhenzi Wu,Shijie Duan,Zhen Wang,Feng Wu,Jiangnan Dai,Jianbin Xu,Changqing Chen,Weida Hu
标识
DOI:10.1002/lpor.202500845
摘要
Abstract Heterogeneous integration of various semiconductors is critical for broadband photodetection, yet current van der Waals integration techniques of 2D and 3D semiconductors face challenges in low process temperature, high‐quality heterointerface, and large‐scale fabrication. Here, a cryogenic‐temperature depositing strategy is presented for fabricating large scale and high‐quality tellurium (Te)/germanium (Ge) heterojunctions, leveraging the narrow bandgap (≈0.33 eV) of Te for broadband photodetection. By employing cryogenic thermal evaporation, wafer‐scale uniformity is achieved in 4‐inch Te films on Ge substrates, with a low roughness of ≈0.71 nm and large crystalline domains on the order of micrometers square. The fabricated Te/Ge heterojunction photodetector exhibits a broadband photoresponse from visible to mid‐infrared and a high performance including a linear dynamic range of 102.5 dB, a responsivity of 0.73 A W −1 , a specific detectivity of 8.47 × 10 10 cm Hz 1/2 W −1 , and rapid rise/fall times of 22 µs/14 µs at zero bias. The superior performance is attributed to the formation of a type‐II heterojunction with a native GeO x interlayer (≈3 nm) for quantum tunneling, which suppresses dark current. Furthermore, an 8 × 8 photodetector array is demonstrated and shows an exceptional uniformity. This work establishes Te/Ge heterojunctions as a versatile platform for next‐generation broadband photodetectors.
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