水准点(测量)
铜互连
沟槽
电阻率和电导率
铜
纳米线
材料科学
分析化学(期刊)
计算机科学
化学
纳米技术
冶金
电气工程
工程类
地质学
环境化学
大地测量学
图层(电子)
作者
Marleen H. van der Veen,N. Heyler,Olalla Varela Pedreira,Ivan Ciofi,Stefan Decoster,V. Vega Gonzalez,N. Jourdan,Herbert Struyf,Kristof Croes,Christopher J. Wilson,Zs. Tôkei
标识
DOI:10.1109/iitc.2018.8430407
摘要
The alternative metals Ru and Co are benchmarked to Cu in a damascene vehicle at scaled dimensions. The Ru and Co nanowires have a higher resistivity but show, when barrierless, a lower increase of the line resistance versus trench cross-sectional area compared to Cu. Therefore, both Ru and Co are superior to Cu in resistance for trenches smaller than 250nm 2 . The electrical benchmark is complemented with via resistance predictions using calibrated models. This modelling indicates a significant reductions of the via resistance for barrierless Co and Ru. The electro migration (EM) performance reveals that the barrierless Ru systems are robust with higher lifetimes compared to Cu and Co.
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