Advanced cooling technology for leading-edge computer products
作者
Richard C. Chu
标识
DOI:10.1109/icsict.1998.785947
摘要
Cooling technology has been a vital prerequisite for the rapid and continued advancement of computer products, ranging from lap-tops to supercomputers. This paper provides a review of the recent development of cooling technology for computers. Both air cooling and liquid cooling are included. Air cooling is discussed in terms of the advantages of impinging flow. An example of module internal conduction enhancement is given. Liquid cooling is discussed in terms of indirect liquid cooling with water coupled with enhanced conduction, and direct immersion cooling with dielectric coolants. Special cooling technology is included in terms of the application of heat pipes and the possibility of using liquid metal flow to cool electronic packages.