Effects of temperature and moisture on module leakage currents

Experimental and analytical results are presented that characterize the rate dependency of leakage currents on environmental temperature and humidity level and quantify the influence of module construction features such as rear-surface films and foils, cell-frame gap spacings, and encapsulant resistivity and thickness. The relative roles of surface and bulk resistivity are illuminated together with their differing dependencies on surface moisture, bulk moisture, and temperature.