钝化
材料科学
电压
高压
聚酰胺
数码产品
光电子学
复合材料
电气工程
图层(电子)
工程类
作者
Jinchang Zhou,Simon S. Ang,Alan Mantooth,Juan Carlos Balda
标识
DOI:10.1109/ecce.2012.6342243
摘要
High current and voltage handling capabilities are desired in many high-performance power electronic modules. One of the main challenges when integrating a power module is having a high-voltage insulation material that is reliable at all operating temperatures. In this work, the use of a polyamide imide (PAI) material as the high-voltage passivation for the power electronic modules was investigated. The power modules were integrated with a two-step passivation-encapsulation process using the PAI material. The fabricated modules were tested up to 10 kV to evaluate the material insulation properties.
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