Ruthenium Electrodeposition from Deep Eutectic Solvents

Ruthenium is electrodeposited for the first time from a deep eutectic solvent based electrolyte composed of ethylene glycol and choline chloride in 1:2 molar ration. Deposition is found to effectively occur upon addition of sulfamic acid to the Ru(III) containing deep eutectic solvent. Optimized plating conditions are able to yield uniform and crack-free coatings up to 800 nm thickness. No oxides or other notable secondary phases can be individuated in the obtained metallic layers.