Novel Ceramic‐Based Material for the Applications of Molded Interconnect Devices (3D‐MID) Based on Laser Direct Structuring

Molded interconnect devices (MID) based on laser direct structuring LPKF‐LDS ® technology are widely used in the realm of electronics. Nowaday, design and development of new materials with improved properties for 3D‐MID are in focus. In this work, novel materials based on alumina ceramic with copper oxide additives are developed for this technology. The effect of the sintering temperature and the doping amount of copper oxide on the metallization quality is investigated. Furthermore, the influence of laser process parameters (e.g., laser power, velocity’, and frequency) on process output namely groove dimensions, groove profile, characteristics of structured area, and quality of the final 3D‐MID products are discussed. The novel ceramic materials show high flexibility to realize very fine structures. Moreover, the laser‐structured and metallized area shows a free edge lap with good quality. After metallization high accuracy with copper line/pitch of 16 μm/20 μm is achieved.