Tuning etch selectivity of fused silica irradiated by femtosecond laser pulses by controlling polarization of the writing pulses

We report on experimental study on chemical etch selectivity of fused silica irradiated by femtosecond laser with either linear or circular polarization in a wide range of pulse energies. The relationships between the etch rates and pulse energies are obtained for different polarization states, which can be divided into three different regions. A drop of the etch rate for high pulse energy region is observed and the underlying mechanism is discussed. The advantage of using circularly polarized laser is justified owing to its unique capability of providing a 3D isotropic etch rate.