Synthesis and properties of polyamide/LLDPE composites with compatibilizer used as hot melt adhesive

In this work, a new polyamide (PA155) was synthesized from higher purity dimer acid, sebacic acid, ethylenediamine, and piperazine, and the ternary blends were prepared by blending PA155 with LLDPE in the presence of the compatibilizer, maleic anhydride grafted linear low-density polyethylene (LLDPE-g-MAH). The weight ratio of PA155 to LLDPE of the samples was kept constant at 80/20 and the amount of LLDPE-g-MAH was varied at 0, 3, 6, 9, and 12 wt% over the total weight of the blend respectively. The scanning electron microscope and mechanical properties tests showed that the compatibility and the mechanical properties were improved with the increase in LLDPE-g-MAH content, and the blend containing 9.0 wt% LLDPE-g-MAH exhibits an optimal miscibility behavior and mechanical properties. The hot melt adhesives which were prepared from the ternary blends were assessed by 180°peel tests of Al/adhesive/polypropylene stack. The peeling strength for the sample containing 9.0 wt% compatibilizer (82.5 N/2.5 cm) is much more than that of the samples without compatibilizer (<20 N/2.5 cm).