薄脆饼
缓冲器(光纤)
生产线
材料科学
二极管
光电子学
破损
直线(几何图形)
电气工程
工程类
复合材料
机械工程
几何学
数学
作者
Maolong Ke,Haihui Luo,Ian Deviny,Xiaoping Dai,Jianwei Huang,Guoyou Liu
摘要
Migrating high power device production from 6 to 8 wafers can significantly reduce unit cost. However, for 1700V freewheeling diodes, it is not practical to continue using the diffused buffer on 8 wafer production line as it has been the norm for 6 wafer production line. This is because much thicker starting wafers are typically used in 8 production line for frontside processing due to the requirement of mechanic stability. Therefore, very large thermal budget would be required to produce a very deep buffer for 8 wafer, leading to significant wafer bow, breakage and cost. Therefore an alternative method of producing sufficiently strong buffer has to be found.
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