功率消耗
无线
物联网
带宽(计算)
计算机科学
光无线
互联网
功率(物理)
电气工程
电信
万维网
工程类
物理
量子力学
作者
Mei-Ju Lu,Sin-Yuan Mu,Chia-Sheng Cheng,Jihan Chen
标识
DOI:10.1109/ectc51906.2022.00014
摘要
With regard to strong demands of internet of things (IoT), 5 th generation wireless 5G, metaverse, and so on, optical communication plays an important role in datacenter and high-performance computing (HPC) application. In this article, we discuss the packaging technologies in terms of assembly and test aimed to realize the co-packaged optics, and to fulfill the requests of high bandwidth and low power consumption when transferring high speed data.
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