热电堆
热电偶
薄脆饼
材料科学
硅
光电子学
表面微加工
比探测率
探测器
红外线的
光学
拓扑(电路)
电气工程
复合材料
物理
光电探测器
制作
工程类
病理
响应度
替代医学
医学
作者
Dan Xue,Wenhan Zhou,Haozhi Zhang,Zao Ni,Wei Li,Jiachou Wang,Xinxin Li
标识
DOI:10.1109/ted.2021.3117190
摘要
This article presents a 96 $\mu \text{m}\,\,\times $ 106 $\mu \text{m}$ sized single-crystalline silicon (SC-Si) /Au thermopile infrared (IR) detector, with the thermopile and IR absorber located at different layers of a double-deck micromechanical structure for improving detectivity. In order to enhance IR-heat absorption within such a tiny device size, an umbrella-shaped SiN IR absorbing membrane instead of traditional plane IR-absorbing film occupies the whole area of the top layer structure. The umbrella-shaped IR absorber is suspended on top of the IR-detecting thermopile layer, with a central umbrella-stick to support the suspending and conducting the absorbed IR-heat to the bottom thermopile layer. The bottom thermopile layer consists of six pairs of spiral-shaped SC-Si/Au thermocouples that feature several times higher Seebeck coefficient compared to the traditional polysilicon/metal thermocouples. By combining surface-micromachining technique with a specific bulk-micromachining process performed in (111) silicon wafer, the double-deck structured IR-detector is successfully fabricated only from the front side of a single (111) silicon wafer for IC-foundry compatible low-cost manufacturing. Testing results show that this device of about 100- $\mu \text{m}$ scale achieves an ultrahigh IR detectivity of 1.01 $\times \,\,10^{{8}}$ cm $\cdot $ Hz $^{{{1}/{2}}}\cdot \text{W}^{-{1}}$ , which is two times improvement compared to the recently reported thermopile IR detectors, though the counterparts had larger device area. Featuring tiny size and batch fabrication capability, the proposed high-performance IR-detector is promising in both single-point detection and multipixel arrayed temperature imaging applications.
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