材料科学                        
                
                                
                        
                            石墨烯                        
                
                                
                        
                            热导率                        
                
                                
                        
                            数码产品                        
                
                                
                        
                            电导率                        
                
                                
                        
                            纳米技术                        
                
                                
                        
                            复合材料                        
                
                                
                        
                            石墨烯纳米带                        
                
                                
                        
                            电气工程                        
                
                                
                        
                            工程类                        
                
                                
                        
                            物理                        
                
                                
                        
                            量子力学                        
                
                        
                    
            作者
            
                Jiajia Chen,Xinjian Gong,Sihua Guo,Yong Zhang,Jin Chen,Yuanyuan Wang,Johan Liu            
         
                    
            出处
            
                                    期刊:International Conference on Electronic Packaging Technology
                                                                        日期:2021-09-14
                                                                
         
        
    
            
            标识
            
                                    DOI:10.1109/icept52650.2021.9568150
                                    
                                
                                 
         
        
                
            摘要
            
            The chase of high performance by chip manufacturers has greatly increased the power consumption of integrated circuits, which brings great challenges to the heat dissipation of electronics systems. It has also slowed down following up of the Moore's Law, and it is expected to hit the wall soon [1]. Graphene film with high in-plane thermal conductivity is one of the key materials to make it possible for electronics industry to continue to follow the Moore's Law. However, there are few studies focusing on the longitudinal thermal conductivity of graphene films. The purpose of this study is to investigate the longitudinal thermal conductivity of graphene films according to ASTM D5470 [2]. The results show that the longitudinal thermal conductivity of the pressed graphene film is greater than that of the unpressurized graphene film. The longitudinal thermal conductivity is 10.6 W/m· K for the unpressurized graphene film and 20.6 W/m· K for the pressed graphene film.
         
            
 
                 
                
                    
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