单片微波集成电路
回波损耗
放大器
材料科学
高电子迁移率晶体管
增益压缩
功率增加效率
功率增益
射频功率放大器
光电子学
微带线
电气工程
W波段
晶体管
工程类
天线(收音机)
CMOS芯片
电压
作者
Armagan Gurdal,Ulas Ozipek,Batuhan Sutbas,Ekmel Ozbay
出处
期刊:European Microwave Conference
日期:2019-05-13
卷期号:: 10-13
被引量:3
摘要
An X-band microstrip power amplifier MMIC based on our 0.25 µm AlGaN/GaN on SiC process technology is presented in this work. Fabrication steps, HEMT structure and typical device performance are demonstrated. Design procedure of the three-stage power amplifier MMIC with a compact size of 4.7 mm × 2.7 mm is described. Small-signal measurements of the fabricated MMICs typically show 36 dB gain with 5 dB ripple and input/output return losses better than 16 dB and 7 dB from 8.5 GHz to 12 GHz band, respectively. Typical output power of 15 W at 6 dB compression with 37%–44% power added efficiency is achieved under pulsed operation. MMIC power measurements performed at different base plate temperatures and bias conditions are also provided. This design exhibits significantly higher gain and much better input return loss compared to MMICs in the literature with similar size, efficiency and output power parameters.
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