Research of Adhesion Among Epoxy Resin, Phenolic Resin and Lead Frame

Epoxy resin and phenolic resin are main components of epoxy molding compound. Cu,Cu/Ag,Cu/Ni Pd Au(PPF) are common lead frames materials on semiconductor packaging. This thesis mainly focuses on the study of the adhesion enhancement between EMC and different lead frames. The influence of resins on Cu/Ag also showed similar influence to Cu and Cu/Ni Pd Au lead frames.