Corrosion Behavior of Red Copper under Medium-high Temperature Environment

The corrosion behavior of red copper using in electronic products are studied in the medium-high temperature.At (80±1)℃ and (50±1)℃,the corrosion behavior of red copper and its surface deposited with sodium chloride salt are investigated by weight loss,Olympus BX51M microscope analysis and XRD.The results show that the weightless quantity increases with prolonged exposure time,but the corrosion rate gradually decreases with prolonged time,finally flattening.With the increase of environmental temperature,the corrosion rate of red copper is greater.The corrosion rate of copper deposited with salt is greater than that of the clean red copper.The presence of chloride ions exacerbates the corrosion of copper.And the corrosion initiates along the deposition area of salt particles on the surface of the red copper deposited with salt,then it extendes to other regions.The corrosion products of the copper exposed to the atmospheric is mainly composed of cuprous oxide,while corrosion products of copper deposited with salt mainly by the cuprous oxide,basic copper chloride,thus corrupting copper deposited with salt even more serious.