化学机械平面化
仿形(计算机编程)
扫描仪
表面粗糙度
原子力显微镜
材料科学
计算机科学
表面光洁度
抛光
人工智能
纳米技术
复合材料
操作系统
作者
Ardavan Zandiatashbar,Byong Kim,Young-kook Yoo,Keibock Lee,Ahjin Jo,Ju Suk Lee,Sang‐Joon Cho,Sang-Il Park
摘要
As the feature size is shrinking in the foundries, the need for inline high resolution surface profiling with versatile capabilities is increasing. One of the important areas of this need is chemical mechanical planarization (CMP) process. We introduce a new generation of atomic force profiler (AFP) using decoupled scanners design. The system is capable of providing small-scale profiling using XY scanner and large-scale profiling using sliding stage. Decoupled scanners design enables enhanced vision which helps minimizing the positioning error for locations of interest in case of highly polished dies. Non-Contact mode imaging is another feature of interest in this system which is used for surface roughness measurement, automatic defect review, and deep trench measurement. Examples of the measurements performed using the atomic force profiler are demonstrated.
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