Study on the microstructure evolution mechanism of copper single phase alloys under deep undercooling conditions

This article mainly used the deep undercooling technology to treat Cu60Ni40, Cu60Ni38Co2, and Cu60Ni35Co5 alloys to obtain different undercoolings. By using high speed cameras, the rapid solidification process was recorded to analyze the relationship between its evolution law and the magnitude of undercooling. When observing its microstructure, it was also found that there was a critical undercooling degree throughout its entire solidification process. The influence of Co element addition on solidification rate, recalescence effect, and critical undercooling of copper based single-phase alloys under undercooling conditions was explored. EBSD analysis was conducted on the refined microstructure of the alloy that achieved the maximum undercooling, and the significance of grain orientation and orientation difference distribution was found. TEM tests were conducted on a Cu60Ni38Co2 alloy with a maximum undercooling of 259 K, and it was found that there are high-density dislocation networks in some areas within them. Finally, the Vickers hardness of the above alloys was measured and recorded using a microhardness tester (HVS-1000Z), and the evolution between microhardness and undercooling, as well as the changes in microhardness under critical undercooling, were analyzed. Based on the analysis of EBSD, TEM, and microhardness data above, it is found that grain refinement at high undercooling is dominated by recrystallization.