Additives induced localized electrodeposition manufacturing of high quality copper micro-rectangular solid structures

High-performance rectangular solid structures at the scale of 10–50 µm are extensively utilized in the fields of optical engineering and bioengineering. However, producing high-purity metallic rectangular solid structures efficiently and economically at the microscale remains an enormous challenge for most current techniques. Here, additives-induced localized electrodeposition micro additive manufacturing (LECD-µAM) technology was innovatively adopted to achieve high-efficiency, high-purity, and high-quality manufacturing of rectangular solid structures. It was found that the synergistic regulatory effect of the additives guides the electrodeposition process, induces the formation of nanotwins, and enhances the surface quality of the microstructures. The rectangular solid structure exclusively comprises copper and oxygen, devoid of any other elements, with a copper content exceeding 99.7%. The principle and mechanism of additives-induced LECD-µAM were deeply and thoroughly analysed, providing valuable theoretical guidance for further research on high-performance electrochemical additive manufacturing techniques. The novel strategy proposed in this study enables the development of new approaches for the preparation and investigation of various solid structures of different shapes.