材料科学
合金
金属间化合物
微观结构
冶金
沉淀硬化
铜
6111铝合金
硬化(计算)
降水
电阻率和电导率
5005铝合金
电导率
复合材料
图层(电子)
工程类
物理化学
气象学
物理
化学
电气工程
作者
Chun-Hao Peng,Po-Yu Hou,Woei-Shyang Lin,Pai-Keng Shen,Hao-Hsuan Huang,Jien‐Wei Yeh,Hung‐Wei Yen,Cheng-Yao Huang,Che‐Wei Tsai
出处
期刊:Materials
[Multidisciplinary Digital Publishing Institute]
日期:2023-01-30
卷期号:16 (3): 1193-1193
被引量:3
摘要
Based on multi-component alloys using precipitation hardening, a Cu-Ni-Si-Fe copper alloy was prepared and studied for hardness, electrical conductivity, and wear resistance. Copper Nickel Silicon (Cu-Ni-Si) intermetallic compounds were observed as precipitates, leading to an increase in mechanical and physical properties. Further, the addition of Fe was discussed in intermetallic compound formation. Moreover, microstructures, age hardening, and dry sliding wear resistances of the present alloy were analyzed and compared with C17200 beryllium copper. The results showed that the present alloy performed extraordinarily, with 314 HV in hardness and 22.2 %IACS in conductivity, which is almost similar to C17200 alloy. Furthermore, the dry sliding wear resistance of the present alloy was 2199.3 (m/MPa·mm3) at an ambient temperature, leading to an improvement of 208% compared with the C17200 alloy.
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