Intelligent food packaging: A perception–response–communication–integration roadmap for sustainable sensing and preservation

活性包装 软件部署 计算机科学 供应链 系统工程 无线 风险分析(工程) 持续性 食品包装 新兴技术 可持续发展 相容性(地球化学) 纳米技术 质量(理念) 标准化 无线传感器网络 过程管理 建筑工程 物联网 生化工程 竞争优势 建筑工程 质量功能配置 实施 增强现实 工程类
作者
Kripa Agarwal,Vibhuti Meharchandani,Shaik Basha,Aradhika Vijeev,Spandana S. Nadig,Krishna Kishore Mahato
出处
期刊:Food Control [Elsevier BV]
卷期号:187: 112162-112162
标识
DOI:10.1016/j.foodcont.2026.112162
摘要

Intelligent food packaging is evolving from passive containment and single-function active films toward systems that can perceive, respond to, and communicate changes in food quality across the supply chain. This review adopts a perception–response–communication–integration framework to synthesize recent advances in sustainable packaging matrices, active and light-activated preservation mechanisms, and multimodal sensing platforms, and to map how these domains jointly condition technology readiness and translational feasibility. First, the review discusses bio-based and biodegradable polymers, including starch, cellulose derivatives, carrageenan, chitosan, and protein-rich agro-industrial by-products, reinforced with nanofibrils, clays, metal oxides, coordination complexes, or carbon nanostructures, emphasizing how crystallinity, chain entanglement, and filler geometry govern gas and moisture barriers, mechanical robustness, and compatibility with chromophores or antimicrobial agents. Second, the review analyze active and light-responsive systems that deliver or utilise photodynamic inactivation, highlighting diffusion mechanisms, stimulus-dependent kinetics, and environment-specific performance in realistic food matrices. Third, the review examines colorimetric, fluorescent, hydrogel-based, and electronic sensors for real-time freshness monitoring, focusing on signal stability, selectivity, and noise in complex, high-humidity headspaces. Finally, the review evaluates emerging digital integration using low-power wireless sensing, edge-AI analytics, and blockchain-enabled traceability, and discusses their current Technology Readiness Levels alongside critical gaps in life-cycle assessment, regulation, and consumer acceptance. By linking structure–property relationships, functional responses, and data infrastructures within a unified framework, this review identifies promising material–technology combinations for near-term deployment and outlines a cautious roadmap toward scalable, environmentally aligned intelligent packaging solutions.
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