Guido Notermans,Anco Heringa,M. van Dort,S. Jansen,Fred G. Kuper
标识
DOI:10.1109/relphy.1999.761607
摘要
In this paper, a new model for localized breakdown in grounded gate NMOSTs under ESD stress is developed which accounts for the reduced ESD strength in silicided devices. The model explains the impact of a stabilizing drain resistance on second breakdown current for both silicided and unsilicided ESD protection NMOSTs.