Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD – FEM modeling study

Bare-die direct liquid jet impingement cooling is an efficient cooling technique that has been successfully applied with various materials including Si, ceramic, metal and plastics. In this paper, we assess the application of liquid jet impingement cooling for a 3D system-on-chip (SoC) interposer package for high performance computing applications (HPC) with a 26x26 mm ² and 8 high-bandwidth memory modules (HBM-2e), using a modeling study based on experimentally validated thermal models. The simulation study shows that the local customization of the impingement nozzle jet plate with a differentiation of the nozzle density depending on the local power density enables the cooling of large interposer packages with more than 2kW power dissipation.