Mechanism of Treating Chloride Ion in Acidic Copper Plating Bath with Copper Powder

The mechanism of treating chloride ion in acidic copper plating bath by using copper powder was illustrated.Theoretical analyses and experimental tests indicated that in acidic copper plating solution Cu2+ ion could react with copper powder to form Cu+ ion and the Cu+ ion could react with chloride ion in the solution to produce cuprous chloride precipitation.When the initial mass concentration of the chloride ions in the acidic copper plating solution was 174 mg/L,the elimination rate of chloride ions after adding 1 g/L copper powders to the solution was 58.9% while that after adding 1 g/L zinc powders was 47.0%.This indicates that the treatment efficiency of chloride ion in the acidic copper plating solution with copper powders is higher than that with zinc powders.