材料科学
微观结构
扩散
固溶体
相图
合金
相(物质)
扩散层
相间
区域熔化
冶金
结晶学
复合材料
图层(电子)
热力学
化学
生物
有机化学
遗传学
物理
摘要
By using diffusion couple made by inlaying,the diffusion-solution zone of Ti/Cu was researched with different anneal condition.The microstructure and forming rule were observed and analysed by means of SEM and EDS.The results shown that the circularity diffusion-solution zone was formed at Ti/Cu interphase,its shape leeched on to Cu silk,number of layers,thickness of all layers and monolayer gradually increased with heating temperature enhanced and holding time prolonged.Its thickness was 93μm,a layer was towards Cu with indention,there were two layers which located on one and the same zone and interveined each other with bamboo shoot shape,its structure was Cu/Cu4Ti/Cu2Ti/Cu3Ti2/Cu4Ti3 /CuTi/CuTi2 /Ti,which included all phases in Ti-Cu binary alloy phase diagram,moreover,the structure was consistent with sequence of each phase located Ti-Cu phase diagram after dealed with heating temperature 700℃and holding time 100 hours.The forming of Ti/Cu diffusion-solution zone was resulted from diffusion,dissolve and crystal of Ti and Cu under the condition of solid phase.
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