Improved Thermal Stability and Electrical Performance by Using PEALD Ultrathin Al2O3 Film with Ta as Cu Diffusion Barrier on Low k Dielectrics

Improved Thermal Stability and Electrical Performance by Using PEALD Ultrathin Al2O3 Film with Ta as Cu Diffusion Barrier on Low k Dielectrics, Ding, Shao-Feng, Xie, Qi, Chen, Fei, Lu, Hai-Sheng, Deng, Shao-Ren, Deduytsche, David, Detavernier, Christophe, Qu, Xin-Ping