硅酮
可靠性(半导体)
材料科学
复合材料
可靠性工程
工程类
热力学
功率(物理)
物理
出处
期刊:PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
日期:2018-06-05
卷期号:: 1-2
摘要
The market requirements for packaging materials including silicone gel are becoming more severe than ever as the operating temperature has increased to 175oC and even higher in the next generation of IGBT modules. In order to guarantee the normal operation in such high temperature environment, it is necessary to improve the high temperature stability and reliability of packaging materials including silicone gel. Newly developed high temperature silicone gels are capable to deal with the new severe conditions and can address to all the requirements for high temperature storage condition. In this presentation, it's described what the failure modes at high temperature storage are and how we could overcome these failure modes.
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