期刊:Proceedings of ESSCIRC日期:2004-11-22卷期号:: 69-72被引量:42
标识
DOI:10.1109/essder.2004.1356490
摘要
The SRAM behavior of FinFET technology is investigated and compared with 90 nm node planar partially-depleted silicon-on-insulator (PD-SOI) technology. Unique FinFET circuit behavior in SRAM applications, resulting from the near-ideal device characteristics, is demonstrated by full cell cross section simulation for the first time, and shows high performance and low active and standby power. SRAM stability is analyzed in detail, as compared to PD-SOI.