电容器
联轴节(管道)
传热
热的
热阻
电子工程
水冷
热传递
可靠性(半导体)
材料科学
控制理论(社会学)
机械
工程类
电压
计算机科学
电气工程
机械工程
物理
热力学
功率(物理)
控制(管理)
人工智能
墨水池
复合材料
作者
Chunlin Lv,Jinjun Liu,Yan Zhang,Jinpeng Yin,Xiaotong Zhang
出处
期刊:IEEE Transactions on Power Electronics
[Institute of Electrical and Electronics Engineers]
日期:2023-06-01
卷期号:38 (6): 7674-7684
被引量:3
标识
DOI:10.1109/tpel.2023.3245629
摘要
Thermal stress is of crucial importance to capacitor reliability. However, for a capacitor bank, on spatial scale, the complex heat transfer modes are not clearly illustrated; and on time scale, the equivalent series resistance (ESR) aging is neither fully discussed in current evaluation methods. These could lead to a glaring error in the prediction of temperature distribution and lifetime estimation. Therefore, this article proposed an analytical thermal modeling method with high-resolution for the capacitor bank, considering the thermal coupling effect between individual capacitors, as well as different cooling conditions and the heat variation caused by ESR aging. First, the improved thermal state-space modeling method is proposed to universally describe a multiple heat source system. Then, based on heat transfer and fluid mechanic theories, the characterization method of thermal coupling effect in different cooling modes is discussed. Furthermore, the ESR aging model is applied in the electrothermal analysis of capacitor bank, aiming to improve the accuracy of thermal calculation in long time scale. Finally, to alleviate the uneven temperature distribution in an in-line designed capacitor bank, a staggered design method is proposed followed by a case study, where a nine-capacitor bank is presented to validate the corresponding modeling method and optimization.
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